Angelo Corsaro, CEO/CTO, ZettaScale talks about the company’s efforts to change the landscape of distributed computing.

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

Cambridge Sensoriis, has extended the capabilities of its proprietary Active Radar Cooperating (ARC) system for UAVs.

Keysight Technologies and the University of Malaga (UMA) have opened a 6G research and innovation Lab.

binder is strategically expanding its connector portfolio to address the needs of rail and transport applications ...

EnSilica awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (C-LEO) programme.

The Agilex eSOM7 Apollo MxFE Development Platform with the eSOM7-2F (2x F-tile) is available for order now through Hitek ...

Mouser signs global distribution agreement with Synaptics, a developer of neural network technologies and HMI devices.

BOW, the universal robotics software company, has successfully closed a £4 million seed round.

Silicon Labs has introduced two new SoCs, the BG22L and BG24L, for Bluetooth LE connectivity, with the BG24L Bluetooth 6.0 ...

PseudolithIC, a US company specialising in RF (radio frequency) chipset products, has successfully raised $6 million.

Quantum Science, a developer of infrared QD technology, is expanding into a new state-of-the-art manufacturing facility.